? semiconductor components industries, llc, 2008 may, 2008 ? rev. 4 1 publication order number: byw51 ? 200/d byw51-200 switchmode power rectifier features and benefits ? low forward voltage ? low power loss/high efficiency ? high surge capacity ? 175 c operating junction temperature ? 16 a total (8 a per diode leg) ? pb ? free packages are available* applications ? power supply ? output rectification ? power management ? instrumentation mechanical characteristics ? case: epoxy, molded ? epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: 1.9 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead temperature for soldering purposes: 260 c max. for 10 seconds ? esd rating: human body model 3b machine model c *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ordering information byw51 ? 200 to ? 220 to ? 220ab case 221a plastic 50 units/rail ultrafast rectifier 16 amperes, 200 volts t rr = 35 ns 1 3 2, 4 a = assembly location y = year ww = work week byw51 ? 200 = device code g = pb ? free package aka = diode polarity http://onsemi.com byw51 ? 200g to ? 220 (pb ? free) 50 units/rail marking diagram ayww byw51 ? 200g aka
byw51 ? 200 http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 200 v average rectified forward current t c = 156 c per leg total device i f(av) 8.0 16 a peak rectified forward current (square wave, 20 khz), t c = 153 c ? per diode leg i fm 16 a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 100 a operating junction temperature and storage temperature t j , t stg ? 65 to +175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic conditions symbol value unit maximum thermal resistance, junction ? to ? case min. pad r jc 3.0 c/w maximum thermal resistance, junction ? to ? ambient min. pad r ja 60.0 electrical characteristics characteristic symbol min typical max unit instantaneous forward voltage (note 1) (i f = 8.0 a, t j = 100 c) (i f = 8.0 a, t j = 25 c) v f ? ? 0.8 0.89 0.89 0.97 v maximum instantaneous reverse current (note 1) (rated dc voltage, t j = 100 c) (rated dc voltage, t j = 25 c) i r ? ? 21 3.8 1000 10 a maximum reverse recovery time (i f = 1.0 a, di/dt = 50 a/s) (i f = 0.5 a, i r = 1.0 a, i rec = 0.25 a) t rr ? ? 35 25 ns 1. pulse test: pulse width = 300 s, duty cycle 2.0%
byw51 ? 200 http://onsemi.com 3 figure 1. typical forward voltage, per leg v f, instantaneous voltage (volts) 0.3 0.6 0.4 0.8 30 0.1 0.3 0.2 2.0 1.0 100 20 7.0 0.7 3.0 0.5 5.0 50 , instantaneous forward current (amps) f 0.9 v r , reverse voltage (volts) 060 40 100 120 400 800 0.08 0.04 0.02 8.0 4.0 2.0 200 40 20 80 t j = 175 c i r 20 80 200 0.5 0.7 10 70 1.0 1.1 1.2 100 c t j = 175 c 25 c 160 180 140 0.8 0.4 0.2 , reverse current ( a) 100 c 25 c * the curves shown are typical for the highest voltage device in the voltage grouping. typical reverse current for lower voltage selections can be es- timated from these same curves if v r is sufficiently below rated v r . i 0.2 v f , instantaneous forward voltage (v) 0.2 0.5 0.4 0.7 0.8 100 0.1 10 0.3 0.6 1.3 figure 2. maximum forward voltage 1.0 1.2 0.9 1.0 figure 3. typical reverse current, per leg* 1.1 i f , instantaneous forward current (a) 175 c 100 c 25 c t a , ambient temperature ( c) 025 2.0 4.0 0 6.0 8.0 10 12 20 50 75 100 125 150 175 square wave dc square wave dc r ja = 16 c/w r ja = 60 c/w (no heatsink) t c , case temperature ( c) 140 155 150 0 4.0 2.0 6.0 10 8.0 20 14 12 145 180 figure 4. current derating, case, per leg 160 175 170 165 18 16 square wave dc figure 5. current derating, ambient, per leg i f(av) , average forward current (a) i f(av) , average forward current (a) 14 16 18
byw51 ? 200 http://onsemi.com 4 1000 10 30 100 300 1.0 10 100 v r , reverse voltage (volts) c, capacitance (pf) t j = 25 c 0 4.0 2.0 4.0 6.0 8.0 24 0 8.0 12 16 20 i f(av) , average forward current (amps) figure 6. power dissipation, per leg t j = 175 c dc square wave 2.0 6.0 10 14 18 10 14 16 20 22 figure 7. typical capacitance, per leg p f(av) , average power dissipation (w) 12 18
byw51 ? 200 http://onsemi.com 5 package dimensions to ? 220 case 221a ? 09 issue af notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension z defines a zone where all body and lead irregularities are allowed. style 6: pin 1. anode 2. cathode 3. anode 4. cathode dim min max min max millimeters inches a 0.570 0.620 14.48 15.75 b 0.380 0.405 9.66 10.28 c 0.160 0.190 4.07 4.82 d 0.025 0.035 0.64 0.88 f 0.142 0.161 3.61 4.09 g 0.095 0.105 2.42 2.66 h 0.110 0.155 2.80 3.93 j 0.014 0.025 0.36 0.64 k 0.500 0.562 12.70 14.27 l 0.045 0.060 1.15 1.52 n 0.190 0.210 4.83 5.33 q 0.100 0.120 2.54 3.04 r 0.080 0.110 2.04 2.79 s 0.045 0.055 1.15 1.39 t 0.235 0.255 5.97 6.47 u 0.000 0.050 0.00 1.27 v 0.045 --- 1.15 --- z --- 0.080 --- 2.04 b q h z l v g n a k f 123 4 d seating plane ? t ? c s t u r j on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 byw51 ? 200/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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